Distribution Chip initiatives pay off for Silica in 2013

Distribution Chip initiatives pay off for Silica in 2013

2013/12/27

The launch of the Power n’ More and ArchiTech initiatives in the first half of the year were significant investments on our part, writes Nigel Ward, regional vice president UK and Ireland, Silica.

Power n’ More boosts technical support for power system designs at device and system levels across every phase of the design cycle and is enabling us to help our customers meet their power ambitions and achieve greater integration across the whole design process.

We are only six months into the programme and we are already seeing double digit growth for order intake and new opportunities. New legislation being introduced over the next three years will mean our customers need to introduce new products to meet the new standards. Our investment now means we will be ideally placed to help them meet the required standard.

ArchiTech is giving our customers a single-point-of-contact for all their design tool requirements. The initiative will help customers to bring new designs to market on time and in the most efficient way. Under the ArchiTech umbrella our customers can find robust development tools, engineering and software expertise, in-depth training and extensive documentation.

These initiatives along with our microcontroller Strategy “Core n’ More” are driving Silica’s growth and differentiating us in the market and will continue to do so through 2014.

The success of our demand creation activities has allowed us to increase our in-house engineering team across Europe throughout the year. Looking forward into 2014 the sales pipeline is looking healthy and the next evolution of the Power n’ More strategy early next year means that further growth and expansion is on the horizon and I look forward to the new year with enthusiasm.

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