TSMC breaks ground for new 20nm plant Electronics News
TSMC has held a groundbreaking cemetery for Phase 3 of its Fab 15 GigaFab facility.
Fab 15, Phase 1 started in July 2010 and completed equipment move-in in mid-2011 with volume production scheduled for early 2012. At the same time, Fab 15, Phase 2 started construction in mid-2011 and is expected to begin volume production later in 2012.
Fab 15 Phases 1 and 2 are forecast to generate as much as US$3 billion in revenue per year once they enter volume production, and Phase 3 will also reach a similar scale in the future.
Fab 15 currently employs approximately 1,400 employees, and is expected to create a total of 8,000 high-quality job opportunities.
Fab 15, Phase 3 will be TSMC’s second GigaFab equipped for 20nm process technology. It will have a capacity of 40,000 300mm wafers per months, and will be used to produce application processors, baseband, graphics processing units, central processing units and FPGAs.
The facility includes various environmental measures, such as classification of process wastewater into 25 categories, an effective process water recycling rate of 90%, water use reduction of 62%, and 5% less power consumption than earlier facilities.
In addition, Fab 15, Phase 3 has a rainwater collection surface of 40,000 square meters, and all collected rainwater is used in landscaping, consuming no water from public utilities.
The treatment effectiveness of cleanroom exhaust will be as high as 98%, waste heat will be recirculated, and solar power and LED lighting will be used.
TSMC breaks ground for new 20nm plant Electronics News